电子开发工程师英文简历表格_简历模板

电子开发工程师英文简历表格

发布时间：2016-12-26 来源：简历模板

电子开发工程师英文简历表格

　　似乎对很多人来说，他们在实施简历书写时，都会非常关注简历的外在效果，在很多人的认知里，只有那些外在效果十分出众的个人简历，才能够在递交至招聘方手中受，吸引到他们的关注，并且在求职过程中增加就职的几率性。但他们却忽视了，太过于注重外在效果的个人简历有时也并不一定可以发挥出对他们而言比较满意的效果。因为这种简历的制作往往会呈现出外在观赏性效果强，而实际内容却不佳的水准。

　　除了上面提及的问题之外，还有一点因素也是求职者必须有所关注的，那就是简历的叙述意义。其实价值的衡量标准在于简历的书写理念。简历本身是一种表达能力非常强的表达方式，所以我们必须要关注它的叙述意义。若失去了简历能够表达出来的运用意义，那么简历也很难凸显出求职者的个人能力。

Name： fwdq			Hukou：Shanghai
Residency：Shanghai			Work Experience：
Current Salary：			Tel：
E-mail：www.fwdq.com
Career Objective
Desired Industry：	Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification
Desired Position：	Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff
Desired address：	Shanghai ,Hongkong ,Beijing ,Taiwan ,Macao			Desired Salary：	Negotiable
Work Experience
20xx/06—Present		***Company
		Industry: Electronics/Semiconductor/IC Intel Flash Engineering Department Individual Contributor Responsibilities： I have been working in Intel Flash Assembly & Test Engineering Department as an Individual Contributor since June of 20xx. Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off: The yield of year 20xx has been dramatically increased than that of year 20xx. The yield of all products, consecutively meets the goal. The total amount of cost saving due to yield improvement is more than $1 million compared with year 20xx. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 20xx. Report Directly to: Department ManagerNumber of Subordinate: 14 Reference: Bao Powel Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off: The yield of year 20xx has been dramatically increased than that of year 20xx. The yield of all products, consecutively meets the goal. The total amount of cost saving due to yield improvement is more than $1 million compared with year 20xx. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 20xx.
20xx/01—20xx/05		Intel(Shanghai) Technology Development Ltd. Company
		Industry: Electronics/Semiconductor/IC Intel STTD-China Department Electronics Development Engineer Responsibilities： I had been working in STTD-China since Jan 20xx to May 20xx as a senior module engineer. At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time. Report Directly to: Hopman Mark Number of Subordinate: 14 Reference: Bao Powel Reason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 20xx. Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.
20xx/05—20xx/01		Nanyang University of Science & Technology
		Industry: Electronics/Semiconductor/IC Electronics & Electrical Engineering Department Research Fellow Responsibilities： I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow. I majored at Gate Oxide Reliability Research in the duration. Report Directly to: Professor Pey Kin Leoh Subordinate: 3 Reference: Patrick Low Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job. Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.
Project Experience
20xx/01—Present		Assembly NPI (New Product Introduction)
		Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it. Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.
20xx/01—20xx/12		Marginal Electrical Boards Rescue
		Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally. Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.
20xx/10—20xx/05		Optimization the current Test Process Order for Flash Memory
		Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me. Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.
20xx/05—20xx/12		Test Yield of Flash memory Improvement
		Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen. Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.
Education and Training
20xx/05—20xx/01		Nanyang University of Science & Technology Microelectronics Doctorate
		I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.
20xx/03—20xx/03		Seoul National University of Korea Microelectronics Others
		I had been working in National Physical Lab of Seoul National University in Korea since March of 20xx to March of 20xx as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.
20xx/03—20xx/03		Shanghai Institute of Microsystems and Information Technology，Chinese Academy of Sciences Information Technology Doctorate
20xx/09—20xx/03		Nanjing University of Science & Technology Material Science and Engineering Master
		Being a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.
20xx/09—20xx/07		Nanjing University of Science & Technology Material Science and Engineering Bachelor
20xx/07—20xx/07		Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department
Professional Skills
Language Skills：		English: EXCELLENT Korean: AVERAGE
Computer Skills：		Technology skilled 96Month SAP understanding 8Month
Certificate：		20xx/11 MCSE 20xx/06 CET6
Self-appraisal
7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.

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